• Date: August 23–25, 2026
• Location: Memorial Auditorium, Stanford, Palo Alto, CA
• Edition: HC38 (38th annual symposium)
• Sponsor: IEEE Technical Committee on Microprocessors and Microcomputers (with ACM SIGARCH)
• Format: Hybrid – in-person + virtual (live stream, downloadable slides, Slack Q&A, session replay)
• URL: https://hotchips.org/

Hot Chips is the annual symposium on high-performance chips. Chip architects present current silicon: microprocessors, accelerators, memory, and the interconnect around them.

The schedule runs one tutorial day followed by two conference days.

• August 23 — two tutorial tracks.
• August 24–25 — keynotes and technical sessions.

Technical sessions are back-to-back 30-minute talks spanning CPU, GPU, Automotive, FPGA, Memory, and Networking, with two AI sessions closing the final day. The 2026 program lists two tutorials, two keynotes, and roughly 25 presentations from architects at AMD, Intel, NVIDIA, Google, and others. A poster session (11 posters in 2026) carries newer and academic work, with a Best Student Poster award selected at the event.

Daniel Rosenband (Waymo) is announced as a keynote speaker.

• Hot Chips — symposium home
• HC2026 attendee site
• Advance program